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More-than-Moore 2.5D and 3D SiP Integration

Name: More-than-Moore 2.5D and 3D SiP Integration
Brand: Springer International Publishing AG
SKU: 19534771
Price: 80.6 EUR
Availability: InStock
Author: RIKO RADOJCIC
ISBN: 9783319849324

RIKO RADOJCIC

Jezik

Angleščina

Knjiga Mehka

Koda Libristo: 19534771

Založba Springer International Publishing AG, maj 2018

This book presents a realistic and a holistic review of the microelectronic and semiconductor techno... Celoten opis

Koda Libristo: 19534771

196 b

80.60 €

Na zalogi pri dobavitelju Odposlali bomo v 5-8 dneh

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This book presents a realistic and a holistic review of the microelectronic and semiconductor technology options in the post Moore's Law regime. Technical tradeoffs, from architecture down to manufacturing processes, associated with the 2.5D and 3D integration technologies, as well as the business and product management considerations encountered when faced by disruptive technology options, are presented. Coverage includes a discussion of Integrated Device Manufacturer (IDM) vs Fabless, vs Foundry, and Outsourced Assembly and Test (OSAT) barriers to implementation of disruptive technology options. This book is a must-read for any IC product team that is considering getting off the Moore's Law track, and leveraging some of the More-than-Moore technology options for their next microelectronic product.