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Modeling and Simulation for Microelectronic Packaging Assembly

Manufacturing, Reliability and Testing

Jezik AngleščinaAngleščina
Knjiga Trda
Knjiga Modeling and Simulation for Microelectronic Packaging Assembly Sheng Liu
Koda Libristo: 01388967
Založba John Wiley & Sons Inc, oktober 2011
Teaches the skills needed to shorten the time for design, manufacturing, reliability, and testing of... Celoten opis
? points 320 b
132.34 €
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Teaches the skills needed to shorten the time for design, manufacturing, reliability, and testing of microelectronic package assembly§Liu and Liu begin with an overview of mechanics and modeling, including modeling validation tools and an explanation of concurrent engineering. They then move on to modeling in microelectronic packaging and assembly, coving packaging and assembly for typical ICs, optoelectronics, MEMS, SIP/3D, and nano interconnects. The next section explains modeling methods for package reliability and test, followed my modern modeling and simulation methodologies.§Models and simulates numerous processes in manufacturing, reliability and testing for the first time§Provides the skills necessary for virtual prototyping and virtual reliability qualification and testing§Demonstrates concurrent engineering and co-design approaches for advanced engineering design of microelectronic products.§Subroutines and color images available for download from the books Companion Site

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O knjigi

Polni naslov Modeling and Simulation for Microelectronic Packaging Assembly
Avtor Sheng Liu, Yong Liu
Jezik Angleščina
Vezava Knjiga - Trda
Datum izida 2011
Število strani 592
EAN 9780470827802
ISBN 0470827807
Koda Libristo 01388967
Založba John Wiley & Sons Inc
Teža 942
Mere 173 x 247 x 35

Kategorije

Technology, Engineering, Agriculture > Electronics & communications engineering > Electronics engineering > Electronics: circuits & components
Technology, Engineering, Agriculture > Mechanical engineering & materials > Production engineering
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