Napačna izbira? Nič za to! Izdelke lahko vrnete do 30 dni
Z darilnim bonom ne morete zgrešiti. Obdarovanec lahko v zameno za darilni bon izbere karkoli iz naše ponudbe.
This book consists of ten chapters on IC packaging technologies, covering failure modes, mechanisms, advanced structures and reliability methods, with a focus on materials, structure and stress.Reliability, a key indicator of product quality, spans multiple disciplines such as materials science and electronics. In China's pursuit of "e;high-quality development"e; a focus on reliability is essential to advancing manufacturing.Written by a leading expert from the State Key Laboratory, this book is important for improving the performance of electronic products and supporting the growth of China's electronic information industry.
Pozdravljeni! Sem Libroamiko, vaš knjižni svetovalec.
Kako vam lahko pomagam?